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State Grid Tongfu Microelectronics

002156.CN | TongFu Microelectronics Co. Ltd. Company Profile

TongFu Microelectronics Co. Ltd. 002156 (China: dual flat no-lead, quad flat no-lead, ball grid array, flip chip, and bump series. The company was founded om February 4, 1994 and is

关于我们_通富微电子股份有限公司

通富微电专注于集成电路封测,努力提升产品的设计研发、品质控制、市场营销、资源整合等四种核心能力,逐步靠实力、业绩、贡献树立起"通富微电"品牌。. 企业文化内涵. 以人为本——在

TFME （通富微電）の半導体とは?

(TFME: TongFu Microelectronics Co.,Ltd.) 本社: 江苏省南通市 (中華人民共和国) 設立年: 1997年: CEO: Shi Lei 石磊 (2008年4月–) 従業員数: 13,594人取引市場: 深圳: 証

合肥通富微电_通富微电子股份有限公司

合肥通富微电-通富微电子股份有限公司通富微电专注于集成电路封测,努力提升产品的设计研发、品质控制、市场营销、资源整合等四种核心能力,逐步靠实力、业绩、贡献树立起"通富微电"

002156 | TongFu Microelectronics Co. Ltd. Profile

TongFu Microelectronics Co., Ltd. engages in the business of integrated circuit assembling and testing. dual flat no-lead, quad flat no-lead, ball grid array, flip chip, and bump series. The

Tongfu Microelectronics Co., Ltd._FCBGA Series,FCCSP

Tongfu Microelectronics engages in products, technologies and services in many fields, including network communication, mobile terminals, household appliances, AI, auto electronics, etc.....More

TongFu Microelectronics Co. Ltd. Financials | 002156

TongFu Microelectronics Co., Ltd. engages in the business of integrated circuit assembling and testing. dual flat no-lead, quad flat no-lead, ball grid array, flip chip, and bump series. The

TongFu Microelectronics is investing in hybrid bonding intellectual

TongFu''s patenting activity related to hybrid bonding. TongFu MicroElectronics, formerly known as Nantong Fujitsu Microelectronics (NFME), has a long-standing presence in

TongFu Microelectronics Co., Ltd

Tongfu Microelectronics Co.,Ltd. was established in October 1997 and listed on the Shenzhen Stock Exchange in August 2007. Its total assets are more than 16 billion yuan. Headquartered in Nantong, Jiangsu Province, Tongfu

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